IS66WVC2M16EALL-7010BLI

Product Overview

Category: Integrated Circuit (IC)

Use: Memory device

Characteristics: - High-speed performance - Low power consumption - Large storage capacity

Package: Ball Grid Array (BGA)

Essence: This product is a high-performance memory IC that offers fast data access and low power consumption. It is designed for applications that require large storage capacity and high-speed data transfer.

Packaging/Quantity: The IS66WVC2M16EALL-7010BLI is available in a BGA package, which provides a compact and reliable form factor. It is typically sold in reels or trays, with a quantity of 1000 units per reel/tray.

Specifications

• Memory Type: Synchronous Dynamic Random Access Memory (SDRAM)
• Capacity: 2 Megabytes (16 Megabits)
• Organization: 2 Meg x 16 bits
• Operating Voltage: 1.8V
• Clock Frequency: Up to 133 MHz
• Data Rate: 266 Mbps
• Interface: Parallel
• Package Dimensions: 9mm x 11mm
• Temperature Range: -40°C to +85°C

Detailed Pin Configuration

The IS66WVC2M16EALL-7010BLI has a total of 54 pins. Below is the detailed pin configuration:

| Pin Number | Pin Name | Description | |------------|----------|-------------| | 1 | VDD | Power supply voltage | | 2 | VDDQ | Power supply voltage for I/O buffers | | 3 | DQ0 | Data input/output bit 0 | | 4 | DQ1 | Data input/output bit 1 | | ... | ... | ... | | 53 | VSSQ | Ground for I/O buffers | | 54 | VSS | Ground |

Functional Features

• High-speed data access: The IS66WVC2M16EALL-7010BLI offers fast data transfer rates, allowing for quick retrieval and storage of information.
• Low power consumption: This memory IC is designed to minimize power usage, making it suitable for battery-powered devices and energy-efficient applications.
• Large storage capacity: With a capacity of 2 Megabytes, this IC can store a significant amount of data, enabling it to handle complex tasks and large datasets.

Advantages and Disadvantages

Advantages: - High-speed performance enables efficient data processing. - Low power consumption prolongs battery life in portable devices. - Large storage capacity allows for handling extensive data requirements.

Disadvantages: - Limited compatibility with certain older systems that do not support the specified interface. - Relatively higher cost compared to lower-capacity memory options.

Working Principles

The IS66WVC2M16EALL-7010BLI operates based on the principles of synchronous dynamic random access memory (SDRAM). It uses a clock signal to synchronize data transfers between the memory device and the host system. When data is read from or written to the memory, it is accessed in bursts, which enhances overall efficiency and speed.

Detailed Application Field Plans

The IS66WVC2M16EALL-7010BLI is commonly used in various electronic devices and systems, including but not limited to: - Personal computers - Laptops and notebooks - Servers - Networking equipment - Industrial automation systems - Medical devices - Automotive electronics

Detailed and Complete Alternative Models

1. IS66WVC2M16DALL-7010BLI: Similar to the IS66WVC2M16EALL-7010BLI, but with a different package type (TSOP instead of BGA).
2. IS66WVC2M16EALL-7010BZLI: Same specifications as the IS66WVC2M16EALL-7010BLI, but with extended temperature range (-40°C to +105°C).
3. IS66WVC4M32EALL-7010BLI: Double the capacity of the IS66WVC2M16EALL-7010BLI, offering 4 Megabytes (32 Megabits) of storage.

These alternative models provide options for different package preferences, temperature requirements, and higher storage capacities while maintaining similar functionality and characteristics.

Note: The content provided above is an example and may not reflect actual product details.