RC28F256P30BFE

Product Overview

• Category: Integrated Circuit
• Use: Memory Storage
• Characteristics: High capacity, fast access speed, non-volatile, compact size
• Package: BGA (Ball Grid Array)
• Essence: Flash memory chip
• Packaging/Quantity: Individually packaged, quantity varies based on manufacturer

Specifications

• Capacity: 256 Megabits (32 Megabytes)
• Interface: Parallel
• Access Time: 30 nanoseconds
• Operating Voltage: 3.3 Volts
• Operating Temperature: -40°C to +85°C
• Data Retention: Minimum 20 years
• Erase/Program Cycles: Minimum 100,000 cycles

Detailed Pin Configuration

The RC28F256P30BFE has a total of 48 pins arranged in a specific configuration. The pinout is as follows:

1. VCC
2. A0
3. A1
4. A2
5. A3
6. A4
7. A5
8. A6
9. A7
10. A8
11. A9
12. A10
13. A11
14. A12
15. A13
16. A14
17. A15
18. A16
19. A17
20. A18
21. A19
22. A20
23. A21
24. A22
25. A23
26. A24
27. A25
28. A26
29. A27
30. A28
31. A29
32. A30
33. A31
34. CE#
35. WE#
36. OE#
37. BYTE#
38. RY/BY#
39. WP#
40. RESET#
41. DQ0
42. DQ1
43. DQ2
44. DQ3
45. DQ4
46. DQ5
47. DQ6
48. DQ7

Functional Features

• High-speed data access and transfer
• Non-volatile memory, retains data even when power is disconnected
• Reliable and durable storage solution
• Compact size for space-constrained applications
• Easy integration into various electronic systems

Advantages and Disadvantages

Advantages: - Large storage capacity - Fast access time - Low power consumption - Wide operating temperature range - Long data retention period

Disadvantages: - Limited erase/program cycles - Relatively higher cost compared to other memory technologies - Requires specific programming algorithms for optimal performance

Working Principles

The RC28F256P30BFE is based on flash memory technology. It utilizes a grid of memory cells that store data using electrically isolated floating gates. These floating gates can be charged or discharged to represent binary values (0s and 1s). The data can be read, written, and erased electronically.

Detailed Application Field Plans

The RC28F256P30BFE is commonly used in various electronic devices and systems, including but not limited to:

1. Solid-state drives (SSDs)
2. Embedded systems
3. Automotive electronics
4. Industrial control systems
5. Networking equipment
6. Consumer electronics (e.g., digital cameras, smartphones)

Detailed and Complete Alternative Models

1. RC28F256P30BFD
2. RC28F256P30BFA
3. RC28F256P30BFB
4. RC28F256P30BFC
5. RC28F256P30BFD

These alternative models offer similar specifications and functionality to the RC28F256P30BFE, providing options for different application requirements.

Note: The alternative models listed above are for illustrative purposes only and may not represent an exhaustive list of available alternatives.

In conclusion, the RC28F256P30BFE is a high-capacity flash memory chip with fast access speed and non-volatile storage capabilities. It finds applications in various electronic devices and systems, offering reliable data storage solutions. While it has advantages such as large capacity and fast access time, it also has limitations like limited erase/program cycles and higher cost compared to other memory technologies. Nonetheless, its working principles and compatibility with alternative models make it a versatile choice for memory storage needs.