XC3S50A-4FT256C

Product Overview

Category

The XC3S50A-4FT256C belongs to the category of programmable logic devices (PLDs).

Use

This product is commonly used in various electronic applications that require high-speed digital signal processing and complex logic functions.

Characteristics

• High-performance FPGA (Field-Programmable Gate Array)
• Low power consumption
• Large number of configurable logic blocks
• Flexible I/O options
• Fast data transfer rates
• Reliable and durable design

Package

The XC3S50A-4FT256C is available in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package.

Essence

The essence of this product lies in its ability to provide designers with a versatile and customizable platform for implementing complex digital circuits.

Packaging/Quantity

The XC3S50A-4FT256C is typically packaged in reels or trays, with each reel or tray containing a specific quantity of devices. The exact packaging and quantity may vary depending on the supplier.

Specifications

• Device Type: FPGA
• Family: Spartan-3A
• Logic Cells: 5,136
• Number of I/Os: 173
• Operating Voltage: 1.2V
• Speed Grade: -4
• Package Type: FBGA
• Package Pins: 256
• Temperature Range: Commercial (0°C to 85°C)

Detailed Pin Configuration

The XC3S50A-4FT256C has a total of 256 pins, each serving a specific purpose in the device's functionality. The pin configuration includes input/output pins, power supply pins, clock pins, and configuration pins. For a detailed pinout diagram and description, please refer to the product datasheet.

Functional Features

• Configurable logic blocks allow for the implementation of complex digital circuits.
• Flexible I/O options enable seamless integration with external devices.
• Dedicated clock management resources ensure precise timing control.
• On-chip memory blocks provide efficient storage for data processing.
• Built-in configuration interface allows for easy programming and reconfiguration.

Advantages and Disadvantages

Advantages

• High-performance FPGA with a large number of logic cells.
• Low power consumption, making it suitable for battery-powered applications.
• Versatile and customizable platform for implementing complex digital circuits.
• Fast data transfer rates enable real-time processing of high-speed signals.
• Reliable and durable design ensures long-term operation.

Disadvantages

• Limited availability of alternative models with similar specifications.
• Higher cost compared to simpler programmable logic devices.
• Steeper learning curve for designers unfamiliar with FPGA technology.

Working Principles

The XC3S50A-4FT256C operates based on the principles of field-programmable gate arrays. It consists of configurable logic blocks interconnected through programmable routing resources. These logic blocks can be programmed to implement various digital functions, allowing designers to create custom circuits tailored to their specific requirements. The device is programmed using hardware description languages (HDL) or specialized software tools provided by the manufacturer.

Detailed Application Field Plans

The XC3S50A-4FT256C finds applications in a wide range of fields, including: 1. Telecommunications: Used in network routers, switches, and communication equipment for high-speed data processing. 2. Industrial Automation: Employed in control systems, motor drives, and robotics for real-time control and signal processing. 3. Automotive Electronics: Integrated into automotive control units, infotainment systems, and driver assistance systems for enhanced functionality. 4. Aerospace and Defense: Utilized in avionics, radar systems, and military-grade electronics for reliable and secure operation. 5. Consumer Electronics: Found in gaming consoles, high-definition televisions, and multimedia devices for advanced processing capabilities.

Detailed and Complete Alternative Models

While the XC3S50A-4FT256C offers a unique combination of features and specifications, there are alternative models available in the market that cater to similar requirements. Some notable alternatives include: 1. XC3S50A-4VQG100C: Similar to XC3S50A-4FT256C but packaged in a smaller Quad Flat No-Lead (QFN) package. 2. XC3S50A-4TQ144C: Offers the same functionality as XC3S50A-4FT256C but with a different pin configuration in a Thin Quad Flat Pack (TQFP) package. 3. XC3S50A-4CP132C: Provides the same logic capacity as XC3S50A-4FT256C but with a different package and pinout arrangement in a Chip Scale Package (CSP).

These alternative models offer designers flexibility in terms of package size, pin configuration, and form factor, allowing them to choose the most suitable option for their specific application requirements.